Patent Assignment
Reel/Frame 043720/0245
Assignment of Assignor's Interest
Recorded: 2017-09-27
Pages: 5
Assignors
CHEN, WEI-YU
Executed: 2017-07-25
HSIEH, CHING-HUA
Executed: 2017-07-25
LIU, CHUNG-SHI
Executed: 2017-08-08
LIN, HSIU-JEN
Executed: 2017-07-25
CHANG, CHIA-LUN
Executed: 2017-07-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Fan-Out Package and Method of Fabricating the Same
Patent:
10,157,862 →
Application:
15/662,266 →