Patent Assignment
Reel/Frame 043720/0261
Assignment of Assignor's Interest
Recorded: 2017-09-27
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2017-08-27
YU, CHUN-HUI
Executed: 2017-08-28
YEE, KUO-CHUNG
Executed: 2017-08-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof