Patent Assignment
Reel/Frame 043752/0270
Assignment of Assignor's Interest
Recorded: 2017-09-05
Pages: 5
Assignors
JUNG, JINHEE
Executed: 2017-08-28
KIM, OHHAN
Executed: 2017-09-04
YOON, INSANG
Executed: 2017-09-04
Assignee
STATS CHIPPAC PTE. LTD.
10 ANG MO KIO STREET 65, TECHPOINT #04-08/09, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming SIP with Electrical Component Terminals Extending Out from Encapsulant
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.