IP Library › Assignment 043756/0048
Patent Assignment
Reel/Frame 043756/0048

Assignment of Assignor's Interest

Recorded: 2017-10-02 Pages: 5
Assignors
HORIBE, AKIHIRO
Executed: 2017-09-19
KOHDA, YASUTERU
Executed: 2017-09-19
MUNETOH, SEIJI
Executed: 2017-09-19
SUBRAMANIAN, CHITRA
Executed: 2017-09-19
SUEOKA, KUNIAKI
Executed: 2017-09-19
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Wafer Scale Testing and Initialization of Small Die Chips
Application: 15/722,409 →
Publication: US 2019/0103327
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 26, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: ELPIS TECHNOLOGIES INC.
Reel/Frame 054528/0023 →