Patent Assignment
Reel/Frame 043757/0658
Assignment of Assignor's Interest
Recorded: 2017-10-02
Pages: 8
Assignors
DAVIS, TARYN J.
Executed: 2015-12-07
FRY, JONATHAN R.
Executed: 2015-12-07
SINHA, TUHIN
Executed: 2015-12-07
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Method and Structure for Flip-Chip Package Reliability Monitoring Using Capacitive Sensors Groups