Patent Assignment
Reel/Frame 043767/0695
Assignment of Assignor's Interest
Recorded: 2017-09-06
Pages: 2
Assignor
IWAFUCHI, TOSHIAKI
Executed: 2017-05-26
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, 108-0075, JAPAN
Covered Property
(1)
Solid State Image Pickup Device and Production Method, Semiconductor Wafer, and Electronic Apparatus