Patent Assignment
Reel/Frame 043768/0852
Assignment of Assignor's Interest
Recorded: 2017-10-03
Pages: 5
Assignors
KOH, HAENGDEOG
Executed: 2017-09-28
KIM, DOYOON
Executed: 2017-09-28
KIM, SEYUN
Executed: 2017-09-28
KIM, JINHONG
Executed: 2017-09-28
KIM, HAJIN
Executed: 2017-09-28
MIZUSAKI, SOICHIRO
Executed: 2017-09-28
BAE, MINJONG
Executed: 2017-09-28
SOHN, HIESANG
Executed: 2017-09-28
LEE, CHANGSOO
Executed: 2017-09-28
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Composite Material, Method of Forming the Same, and Apparatus Including Composite Material
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Feb 22, 2021
From: GED INTEGRATED SOLUTIONS, INC.
To: TCF NATIONAL BANK
Reel/Frame 055357/0011 →
Security Interest
May 25, 2021
From: GED PURCHASER, INC.; GED INTEGRATED HOLDINGS, INC.; GED INTEGRATED SOLUTIONS, INC.; NORFIELD ACQUISITION, LLC
To: TCF NATIONAL BANK, AS ADMINISTRATIVE AGENT
Reel/Frame 056392/0656 →
Release of Security Interest
Jun 28, 2023
From: THE HUNTINGTON NATIONAL BANK (SUCCESSOR BY MERGER TO TCF NATIONAL BANK)
To: GED PURCHASER, INC.; GED INTEGRATED HOLDINGS, INC.; GED INTEGRATED SOLUTIONS, INC.; NORFIELD ACQUISITION, LLC
Reel/Frame 064149/0591 →