Patent Assignment
Reel/Frame 043771/0347
Assignment of Assignor's Interest
Recorded: 2017-10-03
Pages: 4
Assignors
HO, YEN-SHIH
Executed: 2017-10-02
LEE, PO-HAN
Executed: 2017-10-02
CHENG, CHIA-MING
Executed: 2017-10-02
LIN, HSIN-YEN
Executed: 2017-10-02
Assignee
XINTEC INC.
9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK, JHONGLI DIST., TAOYUAN CITY, 32062, TAIWAN
Covered Property
(1)
Chip Package and Method for Forming the Same