Patent Assignment
Reel/Frame 043774/0855
Assignment of Assignor's Interest
Recorded: 2017-09-06
Pages: 5
Assignors
YANG, DEOKKYUNG
Executed: 2017-08-29
LEE, HUNTEAK
Executed: 2017-09-04
LEE, HEESOO
Executed: 2017-08-29
Assignee
STATS CHIPPAC PTE. LTD.
10 ANG MO KIO STREET 65, TECHPOINT #04-08/09, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming a 3D Integrated System-in-Package Module
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.