Patent Assignment
Reel/Frame 043777/0241
Assignment of Assignor's Interest
Recorded: 2017-10-04
Pages: 18
Assignors
LAM, STEPHEN
Executed: 2016-04-21
CIPLICKAS, DENNIS
Executed: 2016-04-15
BROZEK, TOMASZ
Executed: 2016-04-20
CHENG, JEREMY
Executed: 2016-05-06
COMENSOLI, SIMONE
Executed: 2016-04-13
DE, INDRANIL
Executed: 2016-04-12
DOONG, KELVIN
Executed: 2016-04-28
EISENMANN, HANS
Executed: 2016-04-26
FISCUS, TIMOTHY
Executed: 2016-04-13
HAIGH, JONATHAN
Executed: 2016-04-13
HESS, CHRISTOPHER
Executed: 2016-04-12
KIBARIAN, JOHN
Executed: 2016-04-18
LEE, SHERRY
Executed: 2016-04-14
LIAO, MARCI
Executed: 2016-04-15
LIN, SHENG-CHE
Executed: 2016-04-28
MATSUHASHI, HIDEKI
Executed: 2016-04-25
MICHAELS, KIMON
Executed: 2016-04-18
O'SULLIVAN, CONOR
Executed: 2016-04-21
RAUSCHER, MARKUS
Executed: 2016-04-26
ROVNER, VYACHESLAV
Executed: 2016-04-13
STROJWAS, ANDRZEJ
Executed: 2016-04-28
STROJWAS, MARCIN
Executed: 2016-04-13
TAYLOR, CARL
Executed: 2016-04-13
VALLISHAYEE, RAKESH
Executed: 2016-04-12
WEILAND, LARG
Executed: 2016-04-21
YOKOYAMA, NOBUHARU
Executed: 2016-04-13
Assignee
PDF SOLUTIONS, INC.
333 W. SAN CARLOS ST., STE 1000, SAN JOSE, CALIFORNIA, 95110
Covered Properties
(10)
Integrated Circuit Including NCEM-Enabled, Side-to-Side Gap-Configured Fill Cells, with NCEM Pads Formed from at Least Three Conductive Stripes Positioned Between Adjacent Gates
Patent:
9,947,601 →
Application:
15/719,513 →
Integrated Circuit Including Ncem-Enabled, Tip-to-Tip Gap-Configured Fill Cells, with Ncem Pads Formed from at Least Three Conductive Stripes Positioned Between Adjacent Gates
Patent:
9,881,843 →
Application:
15/719,577 →
Integrated Circuit Including NCEM-Enabled, Tip-to-Side Gap-Configured Fill Cells, with NCEM Pads Formed from at Least Three Conductive Stripes Positioned Between Adjacent Gates
Patent:
10,109,539 →
Application:
15/719,584 →
Integrated Circuit Including Ncem-Enabled, Corner Gap-Configured Fill Cells, with Ncem Pads Formed from at Least Three Conductive Stripes Positioned Between Adjacent Gates
Patent:
9,911,668 →
Application:
15/719,595 →
Integrated Circuit Including NCEM-Enabled, Diagonal Gap-Configured Fill Cells, with NCEM Pads Formed from at Least Three Conductive Stripes Positioned Between Adjacent Gates
Patent:
9,911,669 →
Application:
15/719,604 →
Integrated Circuit Including Ncem-Enabled, Interlayer Overlap-Configured Fill Cells, with Ncem Pads Formed from at Least Three Conductive Stripes Positioned Between Adjacent Gates
Patent:
9,870,962 →
Application:
15/719,615 →
Process for Making an Integrated Circuit That Includes Ncem-Enabled, Tip-to-Side Gap-Configured Fill Cells, with Ncem Pads Formed from at Least Three Conductive Stripes Positioned Between Adjacent Gates
Patent:
9,929,063 →
Application:
15/721,762 →
Integrated Circuit Including NCEM-Enabled, Via-Open/Resistance-Configured Fill Cells, with NCEM Pads Formed from at Least Three Conductive Stripes Positioned Between Adjacent Gates
Patent:
9,911,670 →
Application:
15/721,789 →
Integrated Circuit Including NCEM-Enabled, Snake-Configured Fill Cells, with NCEM Pads Formed from at Least Three Conductive Stripes Positioned Between Adjacent Gates
Patent:
9,922,890 →
Application:
15/721,792 →
Process for Making an Integrated Circuit that Includes NCEM-Enabled, Interlayer Overlap-Configured Fill Cells, with NCEM Pads Formed from at Least Three Conductive Stripes Positioned Between Adjacent Gates
Patent:
9,899,276 →
Application:
15/721,890 →