Patent Assignment
Reel/Frame 043801/0140
Assignment of Assignor's Interest
Recorded: 2017-10-05
Pages: 4
Assignors
OU, JEN-KAI
Executed: 2017-10-02
WANG, MENG-JEN
Executed: 2017-10-02
TSAI, TSUNG-YUEH
Executed: 2017-10-02
HUNG, CHIH-MING
Executed: 2017-10-02
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Device