Patent Assignment
Reel/Frame 043802/0158
Assignment of Assignor's Interest
Recorded: 2017-10-06
Pages: 5
Assignors
LIN, SHIH-YEN
Executed: 2017-09-04
CHEN, KUAN-CHAO
Executed: 2017-09-04
LEE, SI-CHEN
Executed: 2017-09-05
PAN, SAMUEL C.
Executed: 2017-09-05
Assignees
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
NATIONAL TAIWAN UNIVERSITY
NO. 1, SEC. 4, ROOSEVELT ROAD, TAIPEI, TAIWAN
Covered Property
(1)
Method of Forming a Semiconductor Device Using Layered Etching and Repairing of Damaged Portions