Patent Assignment
Reel/Frame 043839/0064
Assignment of Assignor's Interest
Recorded: 2017-10-11
Pages: 3
Assignors
TAKEUCHI, MASAKI
Executed: 2017-07-21
MATSUURA, YOSHITSUGU
Executed: 2017-07-28
NAKANO, YUTA
Executed: 2017-07-20
OBATA, KAZUHITO
Executed: 2017-07-21
YASU, KATSUHIKO
Executed: 2017-08-07
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Resin Film for Flexible Printed Circuit Board, Metal Foil Provided with Resin, Coverlay Film, Bonding Sheet, and Flexible Printed Circuit Board
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →