Patent Assignment
Reel/Frame 043843/0207
Assignment of Assignor's Interest
Recorded: 2017-10-12
Pages: 5
Assignors
YU, CHI-YANG
Executed: 2017-09-26
CHEN, CHIN-LIANG
Executed: 2017-09-26
CHEN, HAI-MING
Executed: 2017-09-26
HO, KUAN-LIN
Executed: 2017-09-26
LIANG, YU-MIN
Executed: 2017-09-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Fan-Out Package and Manufacturing Method Thereof
Patent:
10,157,871 →
Application:
15/730,760 →