IP Library › Assignment 043857/0334
Patent Assignment
Reel/Frame 043857/0334

Assignment of Assignor's Interest

Recorded: 2017-10-13 Pages: 2
Assignor
Assignee
TOYOTA JIDOSHA KABUSHIKI KAISHA
1, TOYOTA-CHO, TOYOTA-SHI, AICHI-KEN, 471-8571, JAPAN
Covered Property (1)
Systems Of Bonded Substrates and Methods For Bonding Substrates
Patent: 9,738,056 →
Application: 14/862,564 →
Publication: US 2017/0080682
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 23, 2015
From: JOSHI, SHAILESH N.; NOGUCHI, MASAO; DEDE, ERCAN MEHMET
To: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
Reel/Frame 036635/0169 →
Assignment of Assignor's Interest Apr 1, 2020
From: TOYOTA JIDOSHA KABUSHIKI KAISHA (AKA TOYOTA MOTOR CORPORATION)
To: DENSO CORPORATION
Reel/Frame 052280/0207 →