Patent Assignment
Reel/Frame 052280/0207
Assignment of Assignor's Interest
Recorded: 2020-04-01
Pages: 7
Assignor
TOYOTA JIDOSHA KABUSHIKI KAISHA (AKA TOYOTA MOTOR CORPORATION)
Executed: 2019-12-24
Assignee
DENSO CORPORATION
1-1 SHOWA-CHO, KARIYA-CITY, AICHI-PREF, 448-8661, JAPAN
Covered Properties
(73)
Electric Power Control Unit
Semiconductor Device and Manufacturing Method Thereof
Semiconductor Device
Semiconductor Device
Semiconductor Device
Semiconductor Device
Film Forming Method, Method of Manufacturing Semiconductor Device, and Film Forming Device
Semiconductor Device to Suppress Electric Field Concentration on Insulating Protection Film
Booster Converter Apparatus
Semiconductor Device
Semiconductor Device
Short Circuit Phase Identification Method
Electrically Powered Vehicle, Control Device for Electrically Powered Vehicle, and Computer Readable Medium
Drive System for Rotating Electric Machine
Hybrid Vehicle Having Boost Converter and Control Method of a Hybrid Vehicle Having a Boost Converter
Electric Vehicle and Control Method Therefor
Boosting Device
Controller for Motor Generator
Abnormality Detection Apparatus and Abnormality Detection Method
Power Supply System for Electrically Powered Vehicle
Power Supply Device
Power Supply Device
Power Supply System
Vehicle and Control Method for Vehicle
Vehicle Including Electronic Control Unit Configured to Control Inverter
Vehicle Comprising Electronic Control Unit Configured to Control Inverter by Switching PWM Control
Vehicle
Electric Circuit
Power Converter
Connecting Structure for Refrigerant Pipe and Inverter Including Connecting Structure
Semiconductor Device
Switching Device
Semiconductor Device
Semiconductor Device
Flyback Diode and on-Board Power Source Device
Semiconductor Device and Manufacturing Method of Semiconductor Device
Semiconductor Device
Semiconductor Device with Suppressed Two-Step on Phenomenon
Insulated Gate Switching Element
Semiconductor Device
Inspection Method for Semiconductor Substrate, Manufacturing Method of Semiconductor Device and Inspection Device for Semiconductor Substrate
Method for Manufacturing Diode
Semiconductor Device
Semiconductor Chip and Method for Detecting Disconnection of Wire Bonded to Semiconductor Chip
Semiconductor Device
Method for Manufacturing Semiconductor Device
A Semiconductor Device Comprising a Main Region, a Current Sense Region, and a Well Region
Method for Manufacturing Semiconductor Device Having Grooved Surface
Method for Manufacturing Semiconductor Device Using a Semiconductor Substrate Including Silicon and a First Conductivity Type Body Region
Method for Manufacturing Semiconductor Device
Semiconductor Device
Semiconductor Device and Grinding Method of Semiconductor Device
Semiconductor Module Having Heat Dissipating Portion
Semiconductor Device and Method for Manufacturing Same
Wafer Examination Device and Wafer Examiination Method
Semiconductor Device
Joint Quality Inspection and Joint Quality Inspection Method
Automotive Vehicle
Power Output Apparatus, Method of Controlling the Same, and Vehicle
Electronic Assemblies Having A Cooling Chip Layer With Fluid Channels And Through Substrate Vias
Methods and Apparatuses for High Temperature Bonding and Bonded Substrates Having Variable Porosity Distribution Formed Therefrom
Systems Of Bonded Substrates and Methods For Bonding Substrates
High Temperature Bonding Processes Incorporating Metal Particles and Bonded Substrates Formed Therefrom
Patent:
9,620,434 →
Application:
15/062,893 →
Systems of Bonded Substrates
Patent:
9,418,959 →
Application:
14/794,286 →
Methods for Bonding Substrates with Transient Liquid Phase Bonds by Spark Plasma Sintering
Patent:
9,343,425 →
Application:
14/847,667 →
Cooling Assemblies and Power Electronics Modules Having Multiple-Porosity Structures
Electronic Device Assemblies and Vehicles Employing Dual Phase Change Materials
Electronic Device Assemblies and Vehicles Employing Dual Phase Change Materials
Magnetic Fluid Cooling Devices and Power Electronics Assemblies
Three-Dimensional Power Electronics Packages
Power Electronics Card Assemblies, Power Electronics Modules, and Power Electronics Devices
Power Electronics Modules and Power Electronics Module Assemblies
Power Modules, Cooling Devices and Methods Thereof
Related Assignments
(17)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 20, 2009
From: SHIMANA, TOMOKO; KIMURA, HIRONARI
To: TOYOTA JIDOSHA KABUSHIKI KAISHA
Reel/Frame 022976/0339 →
Assignment of Assignor's Interest
Dec 1, 2009
From: NOZAWA, NATSUKI; HAMATANI, TAKASHI
To: TOYOTA JIDOSHA KABUSHIKI KAISHA
Reel/Frame 023583/0671 →
Assignment of Assignor's Interest
Aug 20, 2012
From: OYOBE, HICHIROSAI; ASHIDA, SHINJIRO
To: TOYOTA JIDOSHA KABUSHIKI KAISHA
Reel/Frame 028813/0025 →
Assignment of Assignor's Interest
Jan 29, 2015
From: ONO, TOSHIKAZU
To: TOYOTA JIDOSHA KABUSHIKI KAISHA
Reel/Frame 034842/0734 →
Assignment of Assignor's Interest
Feb 5, 2015
From: SATO, RYOJI; SUHAMA, MASAYOSHI
To: TOYOTA JIDOSHA KABUSHIKI KAISHA
Reel/Frame 034893/0789 →
Assignment of Assignor's Interest
Mar 13, 2015
From: SATO, RYOJI
To: TOYOTA JIDOSHA KABUSHIKI KAISHA
Reel/Frame 035165/0324 →
Assignment of Assignor's Interest
Oct 29, 2018
From: ASAI, RINTARO
To: TOYOTA JIDOSHA KABUSHIKI KAISHA
Reel/Frame 047339/0415 →
Assignment of Assignor's Interest
Nov 27, 2018
From: SAKAKIBARA, AKINORI
To: TOYOTA JIDOSHA KABUSHIKI KAISHA
Reel/Frame 047593/0458 →
Assignment of Assignor's Interest
Dec 28, 2018
From: NAKAYAMA, WATARU
To: TOYOTA JIDOSHA KABUSHIKI KAISHA
Reel/Frame 047869/0730 →
Assignment of Assignor's Interest
Jan 3, 2019
From: NAGAOKA, TATSUJI
To: TOYOTA JIDOSHA KABUSHIKI KAISHA
Reel/Frame 048004/0546 →
Assignment of Assignor's Interest
Jan 8, 2019
From: TSUCHIMOCHI, SHINGO
To: TOYOTA JIDOSHA KABUSHIKI KAISHA
Reel/Frame 048031/0781 →
Assignment of Assignor's Interest
Jan 29, 2019
From: KAWASHIMA, TAKANORI
To: TOYOTA JIDOSHA KABUSHIKI KAISHA
Reel/Frame 048177/0704 →
Assignment of Assignor's Interest
Jan 29, 2019
From: KAWASHIMA, TAKANORI
To: TOYOTA JIDOSHA KABUSHIKI KAISHA
Reel/Frame 048177/0717 →
Assignment of Assignor's Interest
Feb 4, 2019
From: KAWASHIMA, TAKANORI; OZAKI, HITOSHI
To: TOYOTA JIDOSHA KABUSHIKI KAISHA
Reel/Frame 048259/0090 →
Assignment of Assignor's Interest
Feb 6, 2019
From: KIMURA, MASAHARU
To: TOYOTA JIDOSHA KABUSHIKI KAISHA
Reel/Frame 048279/0561 →
Assignment of Assignor's Interest
Feb 13, 2019
From: KAWASHIMA, TAKANORI
To: TOYOTA JIDOSHA KABUSHIKI KAISHA
Reel/Frame 048327/0297 →
Assignment of Assignor's Interest
Oct 16, 2019
From: OKAWA, TAKASHI
To: TOYOTA JIDOSHA KABUSHIKI KAISHA
Reel/Frame 050737/0118 →