Power modules, cooling devices and methods thereof

1. A jet impingement cooling device comprising:

a jet structure comprising at least one fluid jet for producing an impingement jet of cooling fluid; and

a target layer comprising a heat receiving surface configured to be coupled to a heat generating device, and a jet impingement target surface, the jet impingement target surface further comprising at least one target structure comprising a wavy-fin topology having a fin peak and two inferior peaks adjacent the fin peak, wherein the fluid jet and the target structure are arranged such that the fin peak of the target structure is aligned with a centerline of the impingement jet of cooling fluid during operation of the jet impingement cooling device.

2. The jet impingement cooling device as claimed in claim 1 wherein:

the jet impingement cooling device further comprises a cooling fluid reservoir positioned between the jet structure and the jet impingement target surface; and

the cooling fluid reservoir comprises an outlet that provides a cooling fluid exit flow.

3. The jet impingement cooling device as claimed in claim 1 wherein the wavy-fin topology of the target structure is such that the jet impingement target surface has a maximum operating temperature that is less than a maximum operating temperature of a flat jet impingement target surface when coupled to the heat generating device.

4. The jet impingement cooling device as claimed in claim 1 wherein:

the fluid jet is a continuous slot jet extending from a first end of the jet structure to a second end of the jet structure; and

the target structure extends from a first end of the jet impingement target surface to a second end of the jet impingement target surface.

5. The jet impingement cooling device as claimed in claim 1 wherein:

the fluid jet is a plurality of slot jet segments arranged along an axis extending from a first end of the jet structure to a second end of the jet structure;

the target structure comprises two inferior peaks adjacent the fin peak; and

the target structure extends from a first end of the jet impingement target surface to a second end of the jet impingement target surface.

6. The jet impingement cooling device as claimed in claim 1 wherein:

the fluid jet is a nozzle jet;

the impingement jet of cooling fluid produced by the nozzle jet comprises a circular cross section; and

the target structure comprises a ring shaped projection having an outer ring portion and a conical peak projecting from a center of the outer ring portion, the conical peak defining the fin peak.

7. The jet impingement cooling device as claimed in claim 6 wherein the jet impingement target surface comprises an array of target structures aligned with a corresponding array of nozzle jets.

8. A power module comprising:

a semiconductor module; and

a jet impingement cooling device comprising:

a jet structure comprising at least one fluid jet for producing an impingement jet of cooling fluid;

a target layer further comprising:

a heat receiving surface coupled to a first surface of the semiconductor module; and

a jet impingement target surface, the jet impingement target surface comprising at least one target structure further comprising a wavy-fin topology having a fin peak and two inferior peaks adjacent the fin peak, wherein the fluid jet and the target structure are arranged such that the fin peak of the target structure is aligned with a centerline of the impingement jet of cooling fluid during operation of the jet impingement cooling device; and

a cooling fluid reservoir positioned between the jet structure and the jet impingement target surface, wherein the cooling fluid reservoir receives cooling fluid from the fluid jet and comprises an outlet for providing a cooling fluid exit flow.

9. The power module as claimed in claim 8 wherein the semiconductor module is coupled to the heat receiving surface via a coupling structure comprising:

a first thermally conductive layer;

a bond layer configured to couple the semiconductor module to the first thermally conductive layer;

a ceramic layer coupled to the first thermally conductive layer; and

a second thermally conductive layer coupled to the ceramic layer and the heat receiving surface.

10. The power module as claimed in claim 8 wherein the semiconductor module comprises one or more of the following: an IGBT, a diode, a power MOSFET, and a RC-IGBT.

11. The power module as claimed in claim 8 wherein the wavy-fin topology of the target structure is such that the jet impingement target surface provides a maximum operating temperature that is less than a maximum operating temperature provided by a flat jet impingement target surface when coupled to the semiconductor module.

12. The power module as claimed in claim 8 wherein:

the fluid jet is a continuous slot jet extending from a first end of the jet structure to a second end of the jet structure; and

the target structure extends from a first end of the jet impingement target surface to a second end of the jet impingement target surface.

13. The power module as claimed in claim 8 wherein:

the fluid jet is a plurality of slot jet segments arranged along an axis extending from a first end of the jet structure to a second end of the jet structure;

the target structure comprises two inferior peaks adjacent the fin peak; and

the target structure extends from a first end of the jet impingement target surface to a second end of the jet impingement target surface.

14. The power module as claimed in claim 8 wherein:

the fluid jet is a nozzle jet;

the impingement jet of cooling fluid produced by the nozzle jet comprises a circular cross section; and

the target structure comprises a ring shaped projection having an outer ring portion and a conical peak projecting from a center of the outer ring portion, the conical peak defining the fin peak.

15. The power module as claimed in claim 14 wherein the jet impingement target surface comprises an array of target structures aligned with a corresponding array of nozzle jets.

16. The power module as claimed in claim 8 wherein the power module further comprises a second jet impingement cooling device coupled to a second side of the semiconductor module.

17. A method of cooling a heat generating device comprising:

providing a target layer comprising a heat receiving surface coupled to the heat generating device, and a jet impingement target surface, wherein the jet impingement target surface comprises an array of target structures, each target structure comprising a wavy-fin topology having a fin peak and two inferior peaks adjacent the fin peak;

providing an array of fluid jets; and

directing impingement jets of cooling fluid from the array of fluid jets toward the array of target structures such that each impingement jet of cooling fluid directly impinges the fin peak of each target structure, wherein heat generated by the heat generating device is transferred to the cooling fluid to create a substantially uniform temperature distribution across the jet impingement target surface.

18. The method as claimed in claim 17 wherein the wavy-fin topology of the target structure is such that the jet impingement target surface has a maximum operating temperature that is less than a maximum operating temperature of a flat jet impingement target surface when coupled to the heat generating device.

19. The method as claimed in claim 17 wherein:

the fluid jet is a slot jet extending from a first end of a jet structure to a second end of the jet structure; and

the target structure extends from a first end of the jet impingement target surface to a second end of the jet impingement target surface.

20. The method as claimed in claim 17 wherein:

the fluid jet is a nozzle jet;

the impingement jets of cooling fluid produced by the nozzle jet comprise a circular cross section; and

the target structure comprises a ring shaped projection having an outer ring portion and a conical peak, the conical peak projecting from a center of the outer ring portion and defining the fin peak.