Magnetic fluid cooling devices and power electronics assemblies
Magnetic fluid cooling devices and power electronic devices are disclosed. In one embodiment, a magnetic fluid cooling device includes a magnetic field generating device, a magnetic fluid chamber assembly, and a heat sink device. The magnetic field generating device includes a plurality of magnetic regions having alternating magnetic directions such that magnetic flux generated by the magnetic field generating device is enhanced on a first side of the magnetic field generating device and inhibited on a second side of the magnetic field generating device. The magnetic fluid chamber assembly defines a magnetic fluid chamber configured to receive magnetic fluid. The heat sink device includes a plurality of extending fins, and is thermally coupled to the magnetic fluid chamber assembly. Power electronic devices are also disclosed, wherein the magnetic fluid chamber may be configured as opened or closed.
1. A magnetic fluid cooling device comprising:
a magnetic field generating device configured to generate a magnetic field, wherein the magnetic field generating device comprises a plurality of magnetic regions having alternating magnetic directions such that magnetic flux generated by the magnetic field generating device is enhanced on a first side of the magnetic field generating device and inhibited on a second side of the magnetic field generating device;
a magnetic fluid chamber assembly, wherein:
the magnetic fluid chamber assembly defines a magnetic fluid chamber;
the magnetic fluid chamber comprises a plurality of walls and is configured to accept a magnetic fluid such that the magnetic fluid flows within the magnetic fluid chamber; and
the first side of the magnetic field generating device is coupled to the magnetic fluid chamber assembly; and
a heat sink device comprising a plurality of extending fins, wherein the heat sink device is thermally coupled to the magnetic fluid chamber assembly,
wherein the magnetic field generating device is positioned and configured such that the magnetic field generated by the magnetic field generating device manipulates a flow of the magnetic fluid within the magnetic fluid chamber by thermo-magnetic convection, so that an enhanced fluid recirculation zone of the magnetic fluid is created within the magnetic fluid chamber assembly and disrupts a natural thermal boundary within the magnetic fluid chamber resulting from a heat flux applied to the magnetic fluid chamber assembly.
2. The magnetic fluid cooling device of claim 1 , further comprising a heat generating device coupled to the magnetic fluid chamber assembly.
3. The magnetic fluid cooling device of claim 2 , wherein the heat generating device comprises a semiconductor device.
4. A power electronics assembly comprising:
a semiconductor assembly comprising a semiconductor device;
a magnetic field generating device configured to generate a magnetic field;
a magnetic fluid chamber assembly, wherein:
the magnetic fluid chamber assembly defines a magnetic fluid chamber;
the magnetic fluid chamber comprises a plurality of walls and is configured to accept a magnetic fluid such that the magnetic fluid flows within the magnetic fluid chamber; and
the magnetic fluid chamber assembly is thermally coupled to the semiconductor assembly; and
a heat sink device comprising a plurality of extending fins, wherein the heat sink device is thermally coupled to the magnetic fluid chamber assembly,
wherein the magnetic field generating device is positioned and configured such that the magnetic field generated by the magnetic field generating device manipulates a flow of the magnetic fluid within the magnetic fluid chamber by thermo-magnetic convection, so that an enhanced fluid recirculation zone of the magnetic fluid is created within the magnetic fluid chamber assembly and disrupts a natural thermal boundary within the magnetic fluid chamber resulting from a heat flux applied to the magnetic fluid chamber assembly.
5. The power electronics assembly of claim 4 , wherein the magnetic field generating device and the semiconductor device are positioned in a same plane.
6. The power electronics assembly of claim 4 , wherein the magnetic field generating device is offset with respect to the semiconductor device along a plane parallel to the semiconductor assembly.
7. The power electronics assembly of claim 4 , wherein the magnetic field generating device comprises a permanent magnet or an electromagnetic device.
8. The power electronics assembly of claim 4 , further comprising a magnetic field substrate having a first surface and a second surface, wherein:
the magnetic field generating device is surrounded the magnetic field substrate;
the semiconductor assembly is coupled to the first surface of the magnetic field substrate; and
the magnetic fluid chamber assembly is coupled to the second surface of the magnetic field substrate.
9. The power electronics assembly of claim 8 , wherein:
the magnetic fluid chamber assembly comprises a first surface and a second surface;
the semiconductor assembly is coupled to the first surface of the magnetic field substrate by a first brazing layer; and
the second surface of the magnetic field substrate is coupled to the first surface of the magnetic fluid chamber assembly by a second brazing layer.
10. The power electronics assembly of claim 4 , wherein the magnetic fluid chamber assembly further comprises a magnetic fluid inlet and a magnetic fluid outlet, and the magnetic fluid chamber is configured to accept the magnetic fluid from the magnetic fluid inlet such that the magnetic fluid flows through the magnetic fluid chamber and exits at the magnetic fluid outlet.
11. The power electronics assembly of claim 4 , wherein the magnetic field generating device alters a polarity and one or more field vectors of the magnetic field to align the fluid recirculation zone of the magnetic fluid with one or more hot spots of the heat generating device.
12. The power electronics assembly of claim 4 , wherein the magnetic fluid chamber assembly is an integral component of the heat sink device.
13. The power electronics assembly of claim 12 , wherein the semiconductor assembly and the magnetic field generating device are coupled to a thermal coupling surface of the heat sink device.
14. The power electronics assembly of claim 4 , wherein the semiconductor assembly comprises one or more additional semiconductor devices and one or more additional magnetic field generating devices.
15. The power electronics assembly of claim 14 , wherein the one or more additional magnetic field generating devices have a shape that is different from a shape of the magnetic field generating device.
16. The power electronics assembly of claim 4 , wherein the magnetic field generating device is configured as a Halbach array.
17. The power electronics assembly of claim 4 , further comprising a heat spreader comprising a first surface and a second surface, wherein:
the magnetic fluid chamber assembly comprises a first surface and a second surface;
the semiconductor assembly and the magnetic field generating device are coupled to the first surface of the magnetic fluid chamber assembly;
the second surface of the magnetic fluid chamber assembly is coupled to the first surface of the heat spreader; and
the second surface of the heat spreader is coupled to a thermal coupling surface of the heat sink device.
18. A power electronics assembly comprising:
a semiconductor assembly comprising a semiconductor device;
a magnetic field generating device configured to generate a magnetic field;
a heat sink device comprising a magnetic fluid chamber, a thermal coupling surface, and a plurality of extending fins, wherein:
the magnetic fluid chamber comprises a plurality of walls and is configured to accept a magnetic fluid such that the magnetic fluid flows within the magnetic fluid chamber;
the semiconductor assembly is thermally coupled to the heat sink device; and
the magnetic field generating device is positioned and configured such that the magnetic field generated by the magnetic field generating device manipulates a flow of the magnetic fluid within the magnetic fluid chamber by thermo-magnetic convection, so that an enhanced fluid recirculation zone of the magnetic fluid is created within the magnetic fluid chamber assembly and disrupts a natural thermal boundary within the magnetic fluid chamber resulting from a heat flux applied to the magnetic fluid chamber assembly.
19. The power electronics assembly of claim 18 , further comprising a magnetic field substrate having a first surface and a second surface, wherein:
the magnetic field generating device is surrounded by the magnetic field substrate;
the semiconductor assembly is coupled to the first surface of the magnetic field substrate; and
the second surface of the magnetic field substrate is coupled to the thermal coupling surface of the heat sink device.
20. The power electronics assembly of claim 18 , wherein the semiconductor assembly and the magnetic field generating device are coupled to the thermal coupling surface.