Semiconductor device and grinding method of semiconductor device
A semiconductor device includes a semiconductor chip, and a grinding-processed layer laminated on one surface of the semiconductor chip. Further, the semiconductor device includes a sealing resin that seals the semiconductor chip and the grinding-processed layer; and a metal remaining-thickness checking portion provided adjacent to the grinding-processed layer, sealed by the sealing resin, and having a inclined plane that is inclined with respect to a laminating direction of the grinding-processed layer.
1. A semiconductor device comprising:
a semiconductor chip fixed to a metal plate via a solder layer;
a grinding-processed layer laminated on one surface of the semiconductor chip, the grinding-processed layer includes the solder layer;
a sealing resin that seals the semiconductor chip and the grinding-processed layer; and
a metal remaining-thickness checking portion provided adjacent to the grinding-processed layer, sealed by the sealing resin, and having an inclined plane that is inclined with respect to a laminating direction of the grinding-processed layer, the remaining-thickness checking portion is a wall provided adjacent to the solder layer so as to stand from the metal plate, the wall surrounds the semiconductor chip when the semiconductor chip is viewed in a plane manner, each of the inclined planes opposed to at least two sides of the semiconductor chip when viewed in the plane manner, is provided with a groove or a ridge extending along an inclination direction of each of the inclined planes.
2. The semiconductor device according to claim 1 , wherein:
the groove extending along the inclination direction of the each of the inclined planes, has a triangular shape.
3. The semiconductor device according to claim 1 , wherein:
a plurality of grooves extending along the inclination direction of the each of the inclined planes, are provided.
4. The semiconductor device according to claim 1 , wherein:
the groove extending along the inclination direction of the each of the inclined planes, includes a plurality of inclination angles.
5. A semiconductor device comprising:
a semiconductor chip fixed to a metal plate via a solder layer;
a grinding-processed layer laminated on one surface of the semiconductor chip, the grinding-processed layer includes the solder layer;
a sealing resin that seals the semiconductor chip and the grinding-processed layer; and
a metal remaining-thickness checking portion provided adjacent to the grinding-processed layer, sealed by the sealing resin, and having an inclined plane that is inclined with respect to a laminating direction of the grinding-processed layer, the remaining-thickness checking portion is a wall provided adjacent to the solder layer so as to stand from the metal plate, the inclined plane extends from a surface of the metal plate so as to reach a height corresponding to a plane to be exposed in the semiconductor chip.