Patent Assignment
Reel/Frame 032831/0292
Assignment of Assignor's Interest
Recorded: 2014-05-06
Pages: 4
Assignors
KONDO, TAKESHI
Executed: 2014-03-06
NARUOKA, HIDEKI
Executed: 2014-03-13
TSUKAHARA, HAJIME
Executed: 2014-03-07
Assignee
TOYOTA JIDOSHA KABUSHIKI KAISHA
1, TOYOTA-CHO, TOYOTA-SHI, AICHI-KEN, 471-8571, JAPAN
Covered Property
(1)
Semiconductor Device and Grinding Method of Semiconductor Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.