Electronic device assemblies and vehicles employing dual phase change materials
View Patent ↗Electronic device assemblies employing dual phase change materials and vehicles incorporating the same are disclosed. In one embodiment, an electronic device assembly includes a semiconductor device having a surface, wherein the semiconductor device operates in a transient heat flux state and a normal heat flux state, a coolant fluid thermally coupled to the surface of the semiconductor device, and a phase change material thermally coupled to the surface of the semiconductor device. The phase change material has a phase change temperature at which the phase change material changes from a first phase to a second phase. The phase change material absorbs heat flux at least when the semiconductor device operates in the transient heat flux state.
1. A cooling system comprising:
a cold plate comprising a cooling surface;
a housing coupled to the cooling surface of the cold plate and defining an enclosure to receive a coolant fluid;
one or more thermally conductive features thermally coupled to the cooling surface of the cold plate; and
a phase change material disposed within the one or more thermally conductive features, the phase change material thermally coupled to the cooling surface of the cold plate, wherein the phase change material has a phase change temperature at which the phase change material changes from a first phase to a second phase.
2. The cooling system of claim 1 , wherein the phase change material is a solid when it is at a temperature below the phase change temperature.
3. The cooling system of claim 1 , wherein at least one of the one or more thermally conductive features is physically connected to the cooling surface of the cold plate.
4. The cooling system of claim 1 , wherein at least one of the one or more thermally conductive features is not physically coupled to the cooling surface of the cold plate.
5. The cooling system of claim 1 , wherein the one or more thermally conductive features are located at one or more edges of the cooling surface of the cold plate.
6. The cooling system of claim 1 , wherein the one or more thermally conductive features comprises a plurality of radially arranged thermally conductive features.
7. The cooling system of claim 1 , wherein at least one of the one or more thermally conductive features is a sphere that is not physically connected to the cooling surface of the cold plate.
8. The cooling system of claim 1 , wherein the phase change material comprises paraffin wax.
9. The cooling system of claim 1 , further comprising a jet impingement nozzle configured to direct the coolant fluid toward the cooling surface of the cold plate.
10. The cooling system of claim 1 , wherein the coolant fluid has a fluid phase change temperature that is lower than the phase change temperature of the phase change material.
11. A power electronics module comprising:
a thermally conductive substrate;
a plurality of electronic device assemblies thermally coupled to the thermally conductive substrate, each electronic device assembly of the plurality of electronic device assemblies comprising:
a semiconductor device comprising a surface;
a housing configured to receive a coolant fluid thermally coupled to the surface of the semiconductor device;
one or more thermally conductive features thermally coupled to the surface of the semiconductor device and disposed within the housing; and
a phase change material disposed within the one or more thermally conductive features, the phase change material thermally coupled to the surface of the semiconductor device, wherein the phase change material has a phase change temperature at which the phase change material changes from a first phase to a second phase.
12. The power electronics module of claim 11 , wherein:
the semiconductor device operates in a transient heat flux state and a normal heat flux state; and
the phase change material absorbs heat flux at least when the semiconductor device operates in the transient heat flux state.
13. The power electronics module of claim 11 , wherein the phase change material is a solid when it is at a temperature below the phase change temperature.
14. The power electronics module of claim 11 , wherein at least one of the one or more thermally conductive features is physically connected to the surface of the semiconductor device.
15. The power electronics module of claim 11 , wherein at least one of the one or more thermally conductive features is not physically coupled to the surface of the semiconductor device.
16. The power electronics module of claim 11 , wherein the one or more thermally conductive features are located at one or more edges of the surface of the semiconductor device.
17. The power electronics module of claim 11 , wherein the one or more thermally conductive features comprises a plurality of radially arranged thermally conductive features.
18. The power electronics module of claim 11 , wherein at least one of the one or more thermally conductive features is a sphere that is not physically connected to the surface of the semiconductor device.
19. The power electronics module of claim 11 , wherein each electronics device assembly further comprises a jet impingement nozzle configured to direct the coolant fluid toward the surface of the semiconductor device.
20. The power electronics module of claim 11 , wherein each electronic device assembly further comprises a cold plate comprising a heated surface and a cooling surface, wherein the surface of the semiconductor device is thermally coupled to the heated surface of the cold plate, and the coolant fluid and the phase change material are thermally coupled to the cooling surface of the cold plate.