Electronic assemblies having a cooling chip layer with fluid channels and through substrate vias
An electronics assembly includes a cooling chip structure having a device facing surface opposite a base surface and one or more sidewalls extending around a perimeter of the cooling chip structure between the device facing surface and the base surface. A plurality of fluid microchannels fluidly are coupled to a fluid inlet port and a fluid outlet port. A through substrate via extends from the base surface of the cooling chip structure to the device facing surface of the cooling chip structure, where the through substrate via intersects two or more fluid microchannels of the plurality of fluid microchannels.
1. An electronics assembly comprising:
a cooling chip structure comprising:
a device facing surface opposite a base surface;
one or more sidewalls extending around a perimeter of the cooling chip structure between the device facing surface and the base surface;
a fluid inlet port and a fluid outlet port;
an array of channel fins defining a plurality of fluid microchannels fluidly coupled to the fluid inlet port and the fluid outlet port; and
a through substrate via extending from the base surface of the cooling chip structure to the device facing surface of the cooling chip structure, wherein the through substrate via intersects two or more fluid microchannels of the plurality of fluid microchannels and is disposed between two channel fins of the array of channel fins.
2. The electronics assembly of claim 1 , further comprising a semiconductor device stack comprising:
a semiconductor device comprising a semiconductor material;
a first electrode electrically and thermally coupled to a first device surface of the semiconductor device; and
a second electrode electrically and thermally coupled to a second device surface of the semiconductor device, wherein:
the first device surface is opposite the second device surface;
the through substrate via is electrically coupled to the first electrode; and
the device facing surface of the cooling chip structure is thermally coupled to the semiconductor device stack.
3. The electronics assembly of claim 2 , wherein:
the semiconductor device further comprises one or more semiconductor fluid microchannels extending into the semiconductor device and
the one or more semiconductor fluid microchannels are in fluid communication with the plurality of fluid microchannels of the cooling chip structure.
4. The electronics assembly of claim 2 , wherein the through substrate via provides a power signal receivable by the semiconductor device stack to power the semiconductor device stack.
5. The electronics assembly of claim 1 , wherein the through substrate via is electrically coupled to a third electrode disposed adjacent to the base surface of the cooling chip structure.
6. An electronics assembly comprising:
a cooling chip structure comprising:
a device facing surface opposite a base surface;
one or more sidewalls extending around a perimeter of the cooling chip structure between the device facing surface and the base surface;
a fluid inlet port and a fluid outlet port;
an array of channel fins defining a plurality of fluid microchannels fluidly coupled to the fluid inlet port and the fluid outlet port; and
a through substrate via extending from the base surface of the cooling chip structure to the device facing surface of the cooling chip structure; and
wherein:
the through substrate via is disposed between two channel fins of the array of channel fins;
a first fluid microchannel of the plurality of fluid microchannels is closer to a midpoint of the through substrate via along an axis than a second fluid microchannel of the plurality of fluid microchannels, wherein the first fluid microchannel comprises a first cross-sectional fluid area that is smaller than a second cross-sectional fluid area of the second fluid microchannel.
7. The electronics assembly of claim 6 , further comprising a semiconductor device stack comprising:
a semiconductor device comprising a semiconductor material;
a first electrode electrically and thermally coupled to a first device surface of the semiconductor device; and
a second electrode electrically and thermally coupled to a second device surface of the semiconductor device, wherein:
the first device surface is opposite the second device surface;
the through substrate via is electrically coupled to the first electrode; and
the device facing surface of the cooling chip structure is thermally coupled to the semiconductor device stack.
8. The electronics assembly of claim 7 , wherein:
the semiconductor device further comprises one or more semiconductor fluid microchannels extending into the semiconductor device and
the one or more semiconductor fluid microchannels are in fluid communication with the plurality of fluid microchannels of the cooling chip structure.
9. The electronics assembly of claim 7 , wherein the first electrode, the second electrode and the through substrate via comprise an electrically conductive material.
10. The electronics assembly of claim 6 , further comprising a plurality of through substrate vias.
11. The electronics assembly of claim 6 , wherein the plurality of through substrate vias is arranged in an octagonal arrangement within the cooling chip structure.
12. The electronics assembly of claim 6 , wherein a third fluid microchannel of the plurality of microchannels positioned farther from the midpoint of the through substrate via along the axis than the second fluid microchannel, and the third fluid microchannel has a third cross-sectional fluid area greater than the second cross-sectional fluid area of the second fluid microchannel.
13. The electronics assembly of claim 6 , wherein a third fluid microchannel of the plurality of microchannels positioned farther from the midpoint of the through substrate via along the axis than the second fluid microchannel, and the third fluid microchannel has a third cross-sectional fluid area equal to the second cross-sectional fluid area of the second fluid microchannel.
14. The electronics assembly of claim 6 , wherein the through substrate via intersects a plurality of fluid microchannels, and a dielectric cooling fluid flow within the plurality of fluid microchannels converges around the through substrate via.
15. An electronics assembly comprising:
a cooling chip structure comprising:
a device facing surface opposite a base surface;
one or more sidewalls extending around a perimeter of the cooling chip structure between the device facing surface and the base surface;
a fluid inlet port and a fluid outlet port;
an array of channel fins defining a plurality of fluid microchannels fluidly coupled to the fluid inlet port and the fluid outlet port, wherein the plurality of fluid microchannels comprises a first fluid microchannel and a second fluid microchannel; and
a through substrate via extending from the base surface of the cooling chip structure to the device facing surface of the cooling chip structure, wherein the through substrate via is positioned adjacent the first fluid microchannel and the second fluid microchannel and between two channel fins of the array of channel fins.
16. The electronics assembly of claim 15 , wherein the through substrate via comprises a first substrate via and the cooling chip structure further comprises a second through substrate via and the first fluid microchannel is positioned between the first through substrate via and the second through substrate via.
17. The electronics assembly of claim 15 , further comprising a semiconductor device stack comprising:
a semiconductor device comprising a semiconductor material;
a first electrode electrically and thermally coupled to a first device surface of the semiconductor device; and
a second electrode electrically and thermally coupled to a second device surface of the semiconductor device, wherein:
the first device surface is opposite the second device surface;
the through substrate via is electrically coupled to the first electrode; and
the device facing surface of the cooling chip structure is thermally coupled to the semiconductor device stack.
18. The electronics assembly of claim 17 , wherein:
the semiconductor device further comprises one or more semiconductor fluid microchannels extending into the semiconductor device; and
the one or more semiconductor fluid microchannels are in fluid communication with the plurality of fluid microchannels of the cooling chip structure.
19. The electronics assembly of claim 1 , wherein individual channel fins of the plurality of channel fins are one of straight-fins and wavy-fins.
20. The electronics assembly of claim 15 , wherein individual channel fins of the plurality of channel fins are one of straight-fins and wavy-fins.