IP Library Assignment 041163/0755
Patent Assignment
Reel/Frame 041163/0755

Assignment of Assignor's Interest

Recorded: 2017-02-03 Pages: 3
Assignors
FUKUOKA, YUJI
Executed: 2016-10-25
DEDE, ERCAN
Executed: 2016-11-16
MIYAGI, KYOSUKE
Executed: 2016-11-16
Assignee
TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
25 ATLANTIC AVENUE, ERLANGER, KENTUCKY, 41018
Covered Property (1)
Electronic Assemblies Having A Cooling Chip Layer With Fluid Channels And Through Substrate Vias
Application: 15/423,636 →
Publication: US 2018/0145009
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 8, 2019
From: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
To: TOYOTA JIDOSHA KABUSHIKI KAISHA
Reel/Frame 048548/0181 →
Assignment of Assignor's Interest Apr 1, 2020
From: TOYOTA JIDOSHA KABUSHIKI KAISHA (AKA TOYOTA MOTOR CORPORATION)
To: DENSO CORPORATION
Reel/Frame 052280/0207 →