IP Library › Assignment 048548/0181
Patent Assignment
Reel/Frame 048548/0181

Assignment of Assignor's Interest

Recorded: 2019-03-08 Pages: 2
Assignor
Assignee
TOYOTA JIDOSHA KABUSHIKI KAISHA
1, TOYOTA-CHO, TOYOTA-SHI, AICHI-KEN, 471-8571, JAPAN
Covered Property (1)
Electronic Assemblies Having A Cooling Chip Layer With Fluid Channels And Through Substrate Vias
Application: 15/423,636 →
Publication: US 2018/0145009
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 3, 2017
From: FUKUOKA, YUJI; DEDE, ERCAN; MIYAGI, KYOSUKE
To: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
Reel/Frame 041163/0755 →
Assignment of Assignor's Interest Apr 1, 2020
From: TOYOTA JIDOSHA KABUSHIKI KAISHA (AKA TOYOTA MOTOR CORPORATION)
To: DENSO CORPORATION
Reel/Frame 052280/0207 →