Semiconductor device and method for manufacturing same
The present specification relates to a semiconductor device in which a metal plate is attached onto a surface of a resin package, and provides a structure in which the metal plate is not easy to separate. The semiconductor device disclosed in the present specification includes semiconductor chips (IGBT, diode), a resin package molding the semiconductor chips, and metal plates fixed onto the surface of the resin package. An anchoring member is bridged between two points on a back face of the metal plate. A space between one of the metal plates and the anchoring member is filled with a molding resin of the resin package. The anchoring member firmly bites the resin package, and therefore, the metal plate is difficult to be released from the resin package.
1. A semiconductor device, comprising:
a semiconductor chip;
a resin package molding the semiconductor chip;
a metal plate having the semiconductor chip mounted thereon, being, fixed and exposed at a surface of the resin package; and
an anchoring member bridged between two points on a back surface of the metal plate;
wherein a space between the metal plate and the anchoring member is filled with a resin of the resin package and the anchoring member being completely covered by the resin.
2. The semiconductor device according to claim 1 , further comprising:
a metal wire connecting the semiconductor chip and a terminal within the resin package;
wherein the anchoring member and the metal wire are formed of the same metal material.
3. The semiconductor device according to claim 1 , wherein
a thermal expansion rate of the anchoring member is lower than a thermal expansion rate of the resin package.
4. The semiconductor device according to claim 1 , further comprising:
another semiconductor chip;
wherein the two semiconductor chips are molded in the resin package, and
at least a portion of the anchoring member is positioned between the two semiconductor chips.
5. A method for manufacturing a semiconductor device according to claim 1 , the method comprising the step of:
fixing the anchoring member to the back surface of a metal plate by using a tool for bonding a metal wire connecting the semiconductor chip and a terminal.
6. The method for manufacturing the semiconductor device according to claim 5 , the method further comprising the step of:
connecting the semiconductor chip and the terminal;
wherein the fixing of the anchoring member to the back surface of the metal plate is conducted before the connecting of the semiconductor chip and the terminal.
7. The semiconductor device according to claim 1 , wherein
at least a part of a front surface of the metal plate is exposed from the resin package.
8. The semiconductor device according to claim 1 , further comprising:
another metal plate fixed to an opposite surface of the resin package; and
another anchoring member bridged between two points on a back surface of the other metal plate;
wherein a space between the other metal plate and the anchoring member is filled with the resin of the resin package.