Patent Assignment
Reel/Frame 043859/0547
Assignment of Assignor's Interest
Recorded: 2017-10-13
Pages: 3
Assignor
SU, BINGZHI
Executed: 2017-10-11
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL RD., MD A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Filled Through Silicon Vias for Semiconductor Packages and Related Methods
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
Jul 11, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 046530/0494 →
Release of Security Interest in Patents Recorded at Reel 046530, Frame 0494
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064159/0524 →