Patent Assignment
Reel/Frame 046530/0494
Patent Security Agreement
Recorded: 2018-07-11
Pages: 14
Assignors
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Executed: 2018-02-06
FAIRCHILD SEMICONDUCTOR CORPORATION
Executed: 2018-02-06
Assignee
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
60 WALL STREET, NEW YORK, NEW YORK, 10005
Covered Properties
(88)
Methods and Apparatus for Battery Management
Flexible Semiconductor Package
Patent:
10,177,074 →
Application:
15/724,413 →
Set and Reset Pulse Generator Circuit
Magnetic Sensor Utilizing Magnetization Reset for Sense Axis Selection
Semiconductor Die Package and Manufacturing Method
Resonant Converter and Driving Method Thereof
Electronic Device Including a Dielectric Layer Having a Non-Uniform Thickness
Control Circuit and Method Therefor
System and Method for Shaping Input Current in Light Emitting Diode (Led) System
Electronic Device Including a Hemt
Absolute and Differential Pressure Sensors and Related Methods
Insulated Gate Semiconductor Device Having Trench Termination Structure and Method
Application:
62/571,428 →
Semiconductor Package and Related Methods
Image Sensor with Near-Infrared and Visible Light Pixels
Patent:
10,090,347 →
Application:
15/783,022 →
Filled Through Silicon Vias for Semiconductor Packages and Related Methods
Reducing or Eliminating Transducer Reverberation
Application:
15/784,345 →
Publication:
US US20180160226A1
Structures and Methods of Creating Clear Pixels
Methods and Apparatus for Focus Control in an Imaging System
Synchronous Rectifier Turn-on Enable
Package Including Multiple Semiconductor Devices
Semiconductor Package with Grounding Device and Related Methods
Patent:
10,056,317 →
Application:
15/789,120 →
Galvanically-Isolated Signaling Between Modules with Step-Up Transformer
Adaptive Turn-Off Trigger Blanking for Synchronous Rectification
High Dynamic Range Image Sensors with Flicker and Fixed Pattern Noise Mitigation
Accumulation Enhanced Insulated Gate Bipolar Transistor (Aegt) and Methods of Use Thereof
Vertically Stacked Multichip Modules
Bridgeless Ac-Dc Converter with Power Factor Correction and Method Therefor
Patent:
10,193,437 →
Application:
15/795,025 →
Fault Detection Circuit and Related Methods
Methods and Apparatus for Actuator Control
Application:
62/577,950 →
Global Shutter Image Sensor Pixels Having Improved Shutter Efficiency
Charge Pump and Switch Control Circuit
Burst Operation of a Switching Controller Having a Plurality of Foldback Curves
Patent:
10,141,830 →
Application:
15/799,192 →
High Dynamic Range Pixel with in-Pixel Light Shield Structures
Signal Based Ignition with Inductive Flyback Power
Inductive Position Sensor
Three-Phase Brushless Motor State Identification
Synchronous Rectifier Control with Second Assertion of Drive Signal During Conduction Phase
Audio Switch Circuit for Reducing on-Resistance Variation
Patent:
10,063,223 →
Application:
15/803,906 →
Methods and Apparatus for an Ignition System
Application:
15/805,252 →
Publication:
US US20190136820A1
Intelligent Contact Charging Devices and Methods
High-Electron-Mobility Transistor (Hemt) Semiconductor Devices with Reduced Dynamic Resistance
Image Sensor With Different Pixel Access Settings
Application:
62/583,981 →
Micromachined Multi-Axis Gyroscopes with Reduced Stress Sensitivity
Application:
62/584,361 →
Rotor Position Sensing System for Three Phase Motors and Related Methods
Application:
15/810,693 →
Publication:
US US20180083558A1
Imaging Pixels with a Fully Depleted Charge Transfer Path
Rotor Position Sensing System for Three Phase Motors and Related Methods
Application:
15/810,844 →
Publication:
US US20180069495A1
Self Identification and Pollution Detection in Usb Type-C
Molded Wafer Level Packaging
Low Dropout (Ldo) Voltage Regulator with Soft Start Circuit
Application:
62/585,996 →
Method and Apparatus for Pixel Control Signal Verification in Stack Image Sensor
Application:
62/585,698 →
Oscillator, Method of Operating the Same, and Pwm Controller Including the Same
Integrated Passive Device and Fabrication Method Using a Last Through-Substrate Via
Clip for Semiconductor Package
Patent:
10,204,844 →
Application:
15/814,670 →
Methods and Apparatus for Signal Distribution in an Image Sensor
Regulation Circuit Associated with Synchronous Rectifier Providing Cable Compensation for the Power Converter and Method Thereof
Semiconductor Device and Method of Aligning Semiconductor Wafers for Bonding
Communication for Park Assist Sensors in Adas Systems
Application:
62/588,737 →
Line Ripple Reducer
Application:
62/589,737 →
Average Current and Frequency Control
Flowable Material Level Sensing with Shaped Electrodes
Patent:
10,151,616 →
Application:
15/824,028 →
High Reliability Wafer Level Semiconductor Packaging
Method of Forming a Multilayer Structure for Reducing Defects in Semiconductor Devices and Structure
Patent:
10,242,929 →
Application:
15/827,882 →
All-In-One Method for Wireless Connectivity and Contactless Battery Charging of Small Wearables
Combline Filter Implementation on Semiconductor Wafers
Application:
62/593,725 →
Semiconductor Package and Related Methods
Semiconductor Package and Related Methods
Application:
15/831,663 →
Publication:
US US20190172861A1
Single or Multi Chip Module Package and Related Methods
Control System for Phase-Cut Dimming
Imaging Systems with Data Encryption and Embedding Capabalities
Inter-Poly Oxide in Field Effect Transistors
Application:
15/836,328 →
Publication:
US US20190067427A1
Fan-Out Structure for Semiconductor Packages and Related Methods
Application:
15/837,857 →
Publication:
US US20190181116A1
Methods and Apparatus for an Ignition System
Image Sensors with Low-Voltage Transistors
Transistor Device Having a Pillar Structure
Application:
62/608,462 →
Led Driver Buck Dcdc Convertor Diagnostic
Application:
62/608,434 →
High Reliability Housing for a Semiconductor Package
Application:
15/850,031 →
Publication:
US US20180114804A1
Method and System of Operating Switching Power Converters Based on Peak Current Through the Switching Element
Application:
15/856,147 →
Publication:
US US20190207515A1
Methods and Related Systems of a Readout Circuit for Use with a Wheatstone Bridge Sensor
Electronic Device Including a Transistor Structure Having Different Semiconductor Base Materials
Image Sensors with Calibrated Phase Detection Pixels
Image Sensors with Phase Detection Pixels and a Variable Aperture
Adaptive Feedback Control System and Method for Voltage Regulators
Silicon-Carbide Trench Gate Mosfets and Methods of Manufacture
Chopper-Stabilized Amplifier with Analog-Driven Level Shifter
Application:
62/611,982 →
Superjunction Semiconductor Device and Method of Manufacturing the Same
System for Separating Devices from a Semiconductor Wafer
Patent:
9,153,493 →
Application:
13/742,562 →
Method of Removing Back Metal from an Etched Semiconductor Scribe Street
Patent:
8,450,188 →
Application:
13/136,459 →
Method Using Fluid Pressure to Remove Back Metal from Semiconductor Wafer Scribe Streets
Patent:
8,906,745 →
Application:
14/273,755 →
Related Assignments
(24)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 2, 2017
From: KONDO, HIDEO
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 043759/0053 →
Assignment of Assignor's Interest
Oct 4, 2017
From: PRAJUCKAMOL, ATAPOL; WANG, SOON WEI; LEY, HOE KIT LIEW HOW KAT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 043778/0034 →
Assignment of Assignor's Interest
Oct 9, 2017
From: LEE, KYOUNG MIN; SITCH, KAITLYN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 043816/0747 →
Assignment of Assignor's Interest
Oct 9, 2017
From: MATHER, PHIL
To: FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 043813/0176 →
Assignment of Assignor's Interest
Oct 11, 2017
From: LEE, WON-TAE; JANG, JI-HOON; BAEK, HYEONG SEOK; CHOI, HANG-SEOK
To: FAIRCHILD KOREA SEMICONDUCTOR LTD.
Reel/Frame 044184/0824 →
Assignment of Assignor's Interest
Oct 12, 2017
From: CHIU, CHEN-HUA; ZHANG, GUANG-CHAO; LIN, MAO-SHENG; BAEK, HYEONGSEOK
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 043849/0288 →
Assignment of Assignor's Interest
Oct 12, 2017
From: EUM, HYUNCHUL
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 043850/0019 →
Assignment of Assignor's Interest
Oct 12, 2017
From: GRIVNA, GORDON; LOECHELT, GARY
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 043854/0429 →
Assignment of Assignor's Interest
Oct 12, 2017
From: MOENS, PETER; PADMANABHAN, BALAJI; DE VLEESCHOUWER, HERBERT; VENKATRAMAN, PRASAD
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 043854/0560 →
Assignment of Assignor's Interest
Oct 13, 2017
From: MLINAR, MARKO; GEURTS, TOMAS
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 043857/0385 →
Assignment of Assignor's Interest
Oct 13, 2017
From: SU, BINGZHI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 043859/0547 →
Assignment of Assignor's Interest
Oct 16, 2017
From: HUSTAVA, MAREK; SUCHY, TOMAS; NAVRATIL, MICHAL; KUTEJ, JIRI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 043870/0579 →
Assignment of Assignor's Interest
Oct 16, 2017
From: PRAJUCKAMOL, ATAPOL; CHEW, CH; YAO, YUSHUANG
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 043875/0927 →
Assignment of Assignor's Interest
Oct 17, 2017
From: SEDDON, MICHAEL J.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 043886/0974 →
Assignment of Assignor's Interest
Oct 19, 2017
From: TABUCHI, YOSHIHISA
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 043902/0794 →
Assignment of Assignor's Interest
Oct 19, 2017
From: BORTHAKUR, SWARNAL; CHAPMAN, NATHAN WAYNE; VAARTSTRA, BRIAN ANTHONY
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 043902/0368 →
Assignment of Assignor's Interest
Oct 20, 2017
From: TAO, ZHIBO; KIM, TAESUNG; CHUNG, BONGGEUN; KOO, GWANBON
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 043911/0723 →
Assignment of Assignor's Interest
Oct 25, 2017
From: IM, SEUNGWON; JONG, MANKYO; SON, JOONSEO; JEON, OSEOB
To: FAIRCHILD KOREA SEMICONDUCTOR LTD.
Reel/Frame 043945/0355 →
Assignment of Assignor's Interest
Nov 2, 2017
From: FAIRCHILD KOREA SEMICONDUCTOR, LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044361/0205 →
Assignment of Assignor's Interest
Aug 3, 2021
From: FAIRCHILD SEMICONDUCTOR CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 057694/0374 →
Release of Security Interest
Oct 28, 2021
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 057969/0206 →
Security Interest
Nov 12, 2021
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 058871/0799 →
Release of Security Interest in Patents Recorded at Reel 046530, Frame 0494
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064159/0524 →
Release of Security Interest in Patents Recorded at Reel 058871, Frame 0799
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 065653/0001 →