High reliability wafer level semiconductor packaging
View Patent ↗Implementations of semiconductor packages may include: a semiconductor wafer, a glass lid fixedly coupled to a first side of the semiconductor die by an adhesive, a redistribution layer coupled to a second side of the semiconductor die, and a plurality of ball mounts coupled to the redistribution layer on a side of the redistribution layer coupled to the semiconductor die. The adhesive may be located in a trench around a perimeter of the semiconductor die and located in a corresponding trench around a perimeter of the glass lid.
1. A semiconductor package comprising:
a semiconductor die comprising a first side and a second side;
a first trench comprised in the first side of the semiconductor die, the trench positioned outside an active area of the die;
a glass lid comprising a second trench, the glass lid fixedly coupled to a first side of the semiconductor die by an adhesive;
wherein the adhesive is comprised in the first trench in the first side of the semiconductor die and simultaneously comprised in the second trench positioned around a perimeter of the glass lid;
wherein the adhesive does not cover any edge of the semiconductor die.
2. The semiconductor package of claim 1 , wherein the adhesive is selected from the group consisting of thermal curable resin, epoxy, ultraviolet light curable resin and any combination thereof.
3. The semiconductor package of claim 2 , wherein the adhesive is cured.
4. The semiconductor package of claim 1 , wherein the adhesive is evenly distributed within the first trench and the second trench.
5. The semiconductor package of claim 1 , wherein the adhesive extends out from the first trench and the second trench to further bond the glass lid and the semiconductor die.
6. The semiconductor package of claim 1 , further comprising a redistribution layer coupled to the second side of the semiconductor die.
7. The semiconductor package of claim 6 , further comprising a plurality of ball mounts coupled to the redistribution layer on a side of the redistribution layer opposing the side of the redistribution layer coupled to the semiconductor die.
8. A semiconductor package comprising:
a semiconductor die comprising a first side and a second side;
a first trench comprised around the perimeter of the first side of the semiconductor die; and
a glass lid fixedly coupled to a first side of the semiconductor die by an adhesive, the adhesive comprised in a second trench around a perimeter of the glass lid;
wherein the adhesive is simultaneously comprised in the first trench and the second trench, the trenches comprising corresponding locations in the semiconductor die and the glass lid;
wherein the adhesive does not cover any edge of the semiconductor die.
9. The semiconductor package of claim 8 , wherein the adhesive is selected from the group consisting of thermal curable resin, epoxy, ultraviolet light curable resin and any combination thereof.
10. The semiconductor package of claim 9 , wherein the adhesive is cured.
11. The semiconductor package of claim 8 , wherein the adhesive is evenly distributed within the first trench and the second trench.
12. The semiconductor package of claim 8 , wherein the adhesive extends out from the first trench and the second trench to further bond the glass lid and the semiconductor die.
13. The semiconductor package of claim 8 , further comprising:
a redistribution layer coupled to a second side of the semiconductor die; and
a plurality of ball mounts coupled to the redistribution layer on a side of the redistribution layer opposing the side of the redistribution layer coupled to the semiconductor die.