Patent Assignment
Reel/Frame 043945/0355
Assignment of Assignor's Interest
Recorded: 2017-10-25
Pages: 5
Assignors
IM, SEUNGWON
Executed: 2017-10-11
JONG, MANKYO
Executed: 2017-10-25
SON, JOONSEO
Executed: 2017-10-25
JEON, OSEOB
Executed: 2017-10-11
Assignee
FAIRCHILD KOREA SEMICONDUCTOR LTD.
55, PYEONGCHEON-RO 850 BEON-GIL, WONMI-GU, GYEONGGI-DO, BUCHEON, 14487, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Die Package and Manufacturing Method
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 2, 2017
From: FAIRCHILD KOREA SEMICONDUCTOR, LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044361/0205 →
Patent Security Agreement
Jul 11, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 046530/0494 →
Release of Security Interest in Patents Recorded at Reel 046530, Frame 0494
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064159/0524 →