Semiconductor device and method of aligning semiconductor wafers for bonding
View Patent ↗A semiconductor device has a first semiconductor wafer. The first semiconductor wafer is singulated to provide a first wafer section including at least one first semiconductor die or a plurality of first semiconductor die. The first wafer section is a fractional portion of the first semiconductor wafer. An edge support structure is formed around the first wafer section. A second wafer section includes at least one second semiconductor die. The second wafer section can be an entire second semiconductor wafer. The first semiconductor die is a first type of semiconductor device and the second semiconductor die is a second type of semiconductor device. An alignment opening is formed through the first wafer section and second wafer section with a light source projected through the opening. The first wafer section is bonded to the second wafer section with the first semiconductor die aligned with the second semiconductor die.
1. A method of making a semiconductor device, comprising:
providing a first semiconductor wafer;
singulating the first semiconductor wafer into a plurality of first wafer sections each with a plurality of first semiconductor die;
providing a second wafer including a plurality of second semiconductor die; and
bonding the plurality of first wafer sections to portions of the second wafer with the plurality of the first semiconductor die each aligned respectively with the plurality of second semiconductor die.
2. The method of claim 1 , wherein the plurality of first wafer sections are a fractional portion of the first semiconductor wafer.
3. The method of claim 1 , wherein the plurality of first semiconductor die is a first type of semiconductor device and the plurality of second semiconductor die is a second type of semiconductor device.
4. The method of claim 1 , wherein a size of the plurality of first semiconductor die is different than a size of the plurality of second semiconductor die.
5. The method of claim 1 , further including forming an alignment opening through the plurality of first wafer sections and the second wafer.
6. The method of claim 1 , wherein the plurality of first wafer sections is similar in size to the second wafer.
7. A method of making a semiconductor device, comprising:
providing a first wafer section including a plurality of first semiconductor die;
providing a second wafer including a plurality of second semiconductor die; and
bonding the first wafer section to the second wafer with the plurality of first semiconductor die aligned to the plurality of second semiconductor die.
8. The method of claim 7 , wherein the first wafer section is a fractional portion of a first semiconductor wafer.
9. The method of claim 7 , further including forming an alignment opening through the first wafer section and the second wafer.
10. The method of claim 7 , further including forming an edge support structure around the first wafer section.
11. The method of claim 7 , wherein the plurality of first semiconductor die is a first type of semiconductor device and the second semiconductor die is a second type of semiconductor device.
12. The method of claim 7 , wherein a size of the plurality of first semiconductor die is different than a size of the plurality of second semiconductor die.
13. The method of claim 7 , wherein the first wafer section is similar in size to the second wafer.
14. A semiconductor device, comprising:
a first wafer section including a plurality of first semiconductor die; and
a second wafer including a plurality of second semiconductor die, wherein the first wafer section is bonded to the second wafer to align the first semiconductor die to the second semiconductor die.
15. The semiconductor device of claim 14 , wherein the first wafer section is a fractional portion of a first semiconductor wafer.
16. The semiconductor device of claim 14 , further including an alignment opening formed through the first wafer section and the second wafer.
17. The semiconductor device of claim 14 , further including an edge support structure formed around the first wafer section.
18. The semiconductor device of claim 14 , wherein the first semiconductor die is a first type of semiconductor device and the second semiconductor die is a second type of semiconductor device.
19. The semiconductor device of claim 14 , wherein a size of the first semiconductor die is different than a size of the second semiconductor die.
20. The method of claim 14 , wherein the first wafer section is similar in size to the second wafer.
21. A method of making a semiconductor device, comprising:
providing a first semiconductor die;
providing a second wafer section including a plurality of second semiconductor die; and
bonding the first semiconductor die to the second wafer section with one or more of the plurality of the second semiconductor die aligned to the first semiconductor die.
22. The method of claim 21 , wherein a size of the first semiconductor die is different than a size of one or more of the plurality of second semiconductor die.
23. The method of claim 21 , wherein the first semiconductor die is a first type of semiconductor device and the plurality of second semiconductor die is a second type of semiconductor device.
24. The method of claim 21 , further including forming an alignment opening through the first semiconductor die and the second wafer.