IP Library › Assignment 044174/0712
Patent Assignment
Reel/Frame 044174/0712

Assignment of Assignor's Interest

Recorded: 2017-11-20 Pages: 4
Assignors
SEDDON, MICHAEL J.
Executed: 2016-07-25
CARNEY, FRANCIS J.
Executed: 2016-07-25
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Semiconductor Device and Method of Aligning Semiconductor Wafers for Bonding
Application: 15/817,423 →
Publication: US 2018/0076120
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement Jul 11, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 046530/0494 →
Release of Security Interest in Patents Recorded at Reel 046530, Frame 0494 Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064159/0524 →