Clip for semiconductor package

1. A clip comprising:

a die attach portion comprising at least one protrusion extending from the die attach portion; and

a lead frame alignment portion comprising at least one alignment feature;

wherein the at least one alignment feature is configured to couple into at least one hole in a lead frame thereby aligning the clip with the lead frame; and

wherein the at least one protrusion is configured to couple into at least one recess in the die.

2. The clip of claim 1 , wherein the die attach portion comprises four protrusions extending from the die attach portion.

3. The clip of claim 1 , wherein the lead frame alignment portion comprises two alignment features.

4. The clip of claim 1 , wherein a section of the lead frame alignment portion extends in a first direction substantially perpendicular away from the die attach portion, in a second direction substantially parallel away from the die attach portion, and in a third direction parallel to the first direction.

5. The clip of claim 1 , wherein the alignment feature does not cross a plane formed by the die attach portion.

6. The clip of claim 1 , further comprising a plurality of bond features configured to ensure a minimum bonding compound thickness.

7. A semiconductor package comprising:

a die coupled to a lead frame; and

a clip directly coupled to both the die and the lead frame;

wherein the lead frame and the clip comprise an interlocking alignment mechanism which fixedly couples the clip to the lead frame in a desired physical arrangement;

wherein the interlocking alignment mechanism is configured to prevent movement of the clip during one of reflow and adhesive die attach curing of the die.

8. The package of claim 7 , wherein the interlocking alignment mechanism comprises an alignment feature on the clip and a hole in the lead frame, wherein the alignment feature is configured to couple in the hole.

9. The package of claim 7 , wherein the lead frame and the clip comprise a second interlocking alignment mechanism.

10. The package of claim 7 , wherein the interlocking alignment mechanism does not cross a plane formed by the die.

11. The package of claim 7 , wherein a section of the clip extends in a first direction substantially perpendicular away from the die, in a second direction substantially parallel away from the die, and in a third direction parallel to the first direction.

12. The package of claim 7 , wherein a lead frame alignment portion of the clip extending along a side of the semiconductor package is longer than one of a length and a width of a die attach portion of the clip.

13. A semiconductor package comprising:

a die comprising at least one recess in a first side of the die;

a lead frame coupled to the first side of the die, the lead frame comprising at least one opening therein; and

a clip comprising a die attach portion comprising at least one protrusion extending from the die attach portion; and

a lead frame alignment portion comprising at least one alignment feature;

wherein the at least one alignment feature is configured to slidably couple into the at least one opening in the lead frame; and

wherein the at least one protrusion is configured to couple into the at least one recess in the die.

14. The package of claim 13 , wherein the at least one opening extends completely through the lead frame.

15. The package of claim 13 , wherein the die attach portion comprises four protrusions and the die comprises four corresponding recesses.

16. The package of claim 13 , wherein the lead frame alignment portion comprises two alignment features and the lead frame comprises two openings corresponding with the two alignment features.

17. The package of claim 13 , wherein a cross section of the lead frame alignment portion extends in a first direction substantially perpendicular away from the die, in a second direction substantially parallel away from the die, and in a third direction parallel to the first direction.

18. The package of claim 13 , wherein the alignment feature does not cross a plane formed by the die.

19. The package of claim 13 , wherein a length of the lead frame alignment portion extending along a side of the semiconductor package is longer than one of a length and a width of the die attach portion.

20. The package of claim 13 , wherein the alignment feature is configured to prevent movement of the clip during one of reflow and adhesive die attach curing of the die.