Patent Assignment
Reel/Frame 043868/0389
Assignment of Assignor's Interest
Recorded: 2017-09-15
Pages: 6
Assignors
YANG, DEOKKYUNG
Executed: 2017-09-15
LEE, HUNTEAK
Executed: 2017-09-15
KIM, SUNGSOO
Executed: 2017-09-15
LEE, HEESOO
Executed: 2017-09-15
Assignee
STATS CHIPPAC PTE. LTD.
10 ANG MO KIO STREET 65, TECHPOINT #04-08/09, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming Embedded Die Substrate, and System-in-Package Modules with the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.