Patent Assignment
Reel/Frame 043887/0988
Assignment of Assignor's Interest
Recorded: 2017-10-18
Pages: 7
Assignors
LEE, SANG HYUN
Executed: 2017-05-26
LEE, JEONG YUN
Executed: 2017-05-26
PARK, SEUNG JU
Executed: 2017-05-26
SEONG, GEUM JUNG
Executed: 2017-05-26
OH, YOUNG MOOK
Executed: 2017-05-26
HONG, SEUNG SOO
Executed: 2017-05-26
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method for Fabricating the Same