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Patent Assignment
Reel/Frame 043902/0169

Assignment of Assignor's Interest

Recorded: 2017-10-19 Pages: 4
Assignor
YANG, SONG-YI
Executed: 2017-04-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Electrostatic Chuck Assembly and Semiconductor Manufacturing Apparatus Including the Same
Application: 15/787,940 →
Publication: US 2018/0122680