Patent Assignment
Reel/Frame 043928/0606
Assignment of Assignor's Interest
Recorded: 2017-10-24
Pages: 5
Assignors
LIAO, SHU-HANG
Executed: 2017-09-22
WU, CHIH-WEI
Executed: 2017-09-22
LIN, JING-CHENG
Executed: 2017-09-22
LU, SZU-WEI
Executed: 2017-09-22
SHIH, YING-CHING
Executed: 2017-09-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method of Manufacturing the Same