Patent Assignment
Reel/Frame 043928/0617
Assignment of Assignor's Interest
Recorded: 2017-10-24
Pages: 4
Assignor
CHIU, MING-YEN
Executed: 2017-09-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure Having Integrated Circuit Component with Conductive Terminals of Different Dimensions