Patent Assignment
Reel/Frame 043928/0626
Assignment of Assignor's Interest
Recorded: 2017-10-24
Pages: 4
Assignors
LIU, ZI-JHENG
Executed: 2017-09-19
KUO, CHEN-CHENG
Executed: 2017-09-19
KUO, HUNG-JUI
Executed: 2017-09-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Method of Fabricating Semiconductor Package