Patent Assignment
Reel/Frame 043937/0125
Assignment of Assignor's Interest
Recorded: 2017-10-24
Pages: 6
Assignors
CRISP, RICHARD DEWITT
Executed: 2012-04-02
ZOHNI, WAEL
Executed: 2012-04-02
HABA, BELGACEM
Executed: 2012-04-02
LAMBRECHT, FRANK
Executed: 2012-04-02
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Microelectronic Package Including Microelectronic Elements Having Stub Minimization for Wirebond Assemblies Without Windows
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Nov 24, 2025
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 073689/0754 →
Change of Name
Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073689/0786 →