IP Library Assignment 043944/0305
Patent Assignment
Reel/Frame 043944/0305

Assignment of Assignor's Interest

Recorded: 2017-10-25 Pages: 3
Assignors
JONG, MANKYO
Executed: 2017-10-25
PARK, CHANGYOUNG
Executed: 2017-10-25
Assignee
FAIRCHILD KOREA SEMICONDUCTOR LTD.
55, PYEONGCHEON-RO 850 BEON-GIL, WONMI-GU, GYEONGGI-DO, BUCHEON, 14487, KOREA, REPUBLIC OF
Covered Property (1)
Vertically Stacked Multichip Modules
Application: 15/793,018 →
Publication: US 2018/0138152
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 2, 2017
From: FAIRCHILD KOREA SEMICONDUCTOR, LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044361/0205 →
Patent Security Agreement Jul 11, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 046530/0494 →
Release of Security Interest in Patents Recorded at Reel 046530, Frame 0494 Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064159/0524 →