Patent Assignment
Reel/Frame 043974/0441
Assignment of Assignor's Interest
Recorded: 2017-10-27
Pages: 9
Assignors
TANIGAWA, TAKAO
Executed: 2017-10-13
MIZUNO, YASUYUKI
Executed: 2017-10-13
FUKUDA, TOMIO
Executed: 2017-10-13
NAGAI, YUKI
Executed: 2017-10-13
MURAI, HIKARI
Executed: 2017-10-13
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Thermosetting Resin Composition, Prepreg, Laminate and Multilayer Printed Wiring Board
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →