Patent Assignment
Reel/Frame 043982/0020
Assignment of Assignor's Interest
Recorded: 2017-10-30
Pages: 6
Assignors
KIM, YONG-HOON
Executed: 2017-04-20
KIM, JI-CHUL
Executed: 2017-04-26
CHA, SEUNG-YONG
Executed: 2017-04-26
KIM, JAE-CHOON
Executed: 2017-04-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Image Sensor Package Having Multi-Level Stack Structure