IP Library Assignment 043991/0228
Patent Assignment
Reel/Frame 043991/0228

Assignment of Assignor's Interest

Recorded: 2017-10-31 Pages: 3
Assignors
HU, CHU-CHIN
Executed: 2017-10-18
HSU, SHIH-PING
Executed: 2017-10-18
Assignee
PHOENIX PIONEER TECHNOLOGY CO., LTD.
NO.458-17, XINXING RD., HUKOU TOWNSHIP, HSINCHU COUNTY, 30353, TAIWAN
Covered Property (1)
Package Substrate Having a Plurality of Chips Electrically Connected by Conductive Vias and Wiring Bonding
Application: 15/798,698 →
Publication: US 2018/0130771
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 25, 2018
From: PHOENIX PIONEER TECHNOLOGY CO., LTD.
To: PHOENIX & CORPORATION
Reel/Frame 044724/0424 →
Assignment of Assignor's Interest Jun 23, 2020
From: PHOENIX & CORPORATION
To: PHOENIX PIONEER TECHNOLOGY CO., LTD.
Reel/Frame 053010/0360 →