Patent Assignment
Reel/Frame 043997/0519
Assignment of Assignor's Interest
Recorded: 2017-10-31
Pages: 5
Assignors
PENG, TAI-YEN
Executed: 2017-10-20
WEI, HUI-HSIEN
Executed: 2017-10-19
WEN, WEI-CHIH
Executed: 2017-10-20
DAI, PIN-REN
Executed: 2017-10-20
LEE, CHIEN-MIN
Executed: 2017-10-20
TSAI, HAN-TING
Executed: 2017-10-20
SHIEH, JYU-HORNG
Executed: 2017-10-20
LIN, CHUNG-TE
Executed: 2017-10-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Memory Device and Fabrication Method Thereof