Patent Assignment
Reel/Frame 043998/0610
Assignment of Assignor's Interest
Recorded: 2017-11-01
Pages: 5
Assignors
ANG, AI-TEE
Executed: 2017-10-11
CHEN, SHING-CHAO
Executed: 2017-10-11
HSIEH, CHING-HUA
Executed: 2017-10-11
LIN, CHIH-WEI
Executed: 2017-10-11
LIN, CHING-YAO
Executed: 2017-10-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Fan-Out Package and Manufacturing Method Thereof