IP Library Assignment 044008/0368
Patent Assignment
Reel/Frame 044008/0368

Assignment of Assignor's Interest

Recorded: 2017-11-01 Pages: 3
Assignors
YAMAGUCHI, HIDETO
Executed: 2013-09-03
KOSUGI, TETSUYA
Executed: 2013-09-03
UENO, MASAAKI
Executed: 2013-09-03
Assignee
HITACHI KOKUSAI ELECTRIC, INC.
15-12, NISHI-SHIMBASHI 2 CHOME, MINATO-KU, TOKYO, 105-8039, JAPAN
Covered Property (1)
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, and Thermocouple Support
Application: 15/789,311 →
Publication: US 2018/0040520
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 047995/0462 →