Patent Assignment
Reel/Frame 044022/0402
Assignment of Assignor's Interest
Recorded: 2017-11-02
Pages: 4
Assignor
JUNG, JIN-YOUNG
Executed: 2017-04-10
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Package Substrate and Chip Stack in Which a Lower Chip Has a Respective Dummy Pad by Which Each Upper Chip Is Connected to the Package Substrate