Patent Assignment
Reel/Frame 044023/0381
Assignment of Assignor's Interest
Recorded: 2017-11-02
Pages: 5
Assignors
LEE, HAN UL
Executed: 2017-09-26
KIM, JIN SU
Executed: 2017-09-26
KO, YOUNG GWAN
Executed: 2017-09-26
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Passivation Layer Having an Opening for Under Bump Metallurgy
Patent:
10,026,668 →
Application:
15/802,170 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.