Patent Assignment
Reel/Frame 044024/0795
Assignment of Assignor's Interest
Recorded: 2017-11-03
Pages: 6
Assignors
CHEN, WEI-YU
Executed: 2017-10-23
SU, AN-JHIH
Executed: 2017-10-23
WU, CHI-HSI
Executed: 2017-10-26
YEH, DER-CHYANG
Executed: 2017-10-23
HUANG, LI-HSIEN
Executed: 2017-10-24
TSAI, PO-HAO
Executed: 2017-10-24
YEH, MING-SHIH
Executed: 2017-10-24
LIU, TA-WEI
Executed: 2017-10-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Package Structure and Manufacturing Method Thereof