IP Library › Assignment 044027/0610
Patent Assignment
Reel/Frame 044027/0610

Assignment of Assignor's Interest

Recorded: 2017-11-03 Pages: 3
Assignors
LIN, CHENGCHUNG
Executed: 2017-09-19
CAI, QIFENG
Executed: 2017-09-19
Assignee
SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
78 CHANGSHAN AVENUE, JIANGYIN CITY, 214437, CHINA
Covered Property (1)
Fan-Out Package Structure, And Manufacturing Method Thereof
Application: 15/571,581 →
Publication: US 2018/0158798